berex b c g13d http: //www.berex.com 5-4000 mhz cascadeable ingap hbt gain block device features ? 33 dbm output ip3 at 5dbm/tone ? 24.9 db gain at 900 mhz ? 18 dbm p1db ? highly reliable ingap/gaas hbt technology ? 50 ohm cascadeable ? application: commercial wireless system target device performance (t a = 25 c) symbols test conditions min typ max unit frequency range 5 4000 mhz gain 900 mhz 1900 mhz 2450 mhz 23.9 22.0 20.6 24.9 23.0 21.6 25.9 24.0 22.6 db s11 900 mhz 1900 mhz 2450 mhz -11.7 -10.4 -11.9 db s22 900 mhz 1900 mhz 2450 mhz -7.6 -13.4 -12.0 db oip3 900 mhz 1900 mhz 2450 mhz 31.0 30.7 29.5 33.0 32.7 31.5 dbm p1db 900 mhz 1900 mhz 2450 mhz 17.3 17.2 16.4 18.3 18.2 17.4 dbm ic vc = 5.0v 59 69 79 ma vc 5.0 v dg/dt -0.007 db/ c rth thermal resistance 85 c/w test conditions unless otherwise noted. 1. device performance is measured on berex evaluation board at 25c, 50 ohm system 2. oip3 measured with two tones at an output power of 5 dbm/tone separated by 1 mhz. absolute maximum ratings parameter rating operating case temperature -40 to +85 c storage temperature -40 to +155 c operating voltage +5.5v supply current 150 ma input rf power 23dbm operation of this device above any of these parameters may result in permanent damage.
berex b c g13d http: //www.berex.com s-parameter test circuit chip attachment on pf083 i-v characteristics generic pf083 evaluation board (31mil thick fr4) application circuit: 5-4000 mhz typical performance (vc = 5v, ic = 69ma, t = 25 c) freq mhz 900 1900 2450 s21 db 24.9 23.0 22.5 s11 db -11.7 -10.4 -11.9 s22 db -7.6 -13.4 -12.0 p1 dbm 19.0 19.0 19.0 oip3 dbm 32.0 32.0 31.0
berex b c g13d http: //www.berex.com schematic diagram bom tolerance c1 100pf 5% c2 100pf 5% c3 100pf 5% c4 1000pf 5% c5 10uf 20% l1* 39nh 5% *note: 1. chip is mounted on the pf083 open pkg, and bonded with 2-wires at both input and output. 2. less than 20nh improves rf performance at frequencies over 1.9ghz. 3. 40nh or higher value l1 improves rf performance at frequencies under 500mhz. 4. optimum value of l1 may vary with board design . typical device data s-parameters (vc=5v, ic=65ma, t=25 c)
berex b c g13d http: //www.berex.com device performance p1db-gain p1 gain oip3
berex b c g13d http: //www.berex.com acpr s-parameter (vdevice = 5.0v, icc = 69ma, t = 25 c, calibrated to device leads) freq [mhz] s11 [db] s11 [ang] s21 [db] s21 [ang] s12 [db] s12 [ang] s22 [db] s22 [ang] 100 -4.678 -25.54 25.672 176.84 -35.909 77.16 -1.418 173.59 500 -11.610 -16.90 25.427 159.35 -30.250 -25.07 -6.267 29.56 1000 -12.057 -12.98 24.828 141.93 -29.445 50.31 -8.236 -7.08 1500 -13.053 16.38 23.968 124.40 -30.025 -114.05 -12.494 -26.17 2000 -9.849 17.27 22.767 109.52 -29.185 -159.59 -12.806 -17.49 2500 -12.146 -27.86 21.639 96.24 -28.649 158.92 -11.873 -64.24 3000 -13.490 -123.12 20.413 84.08 -29.741 116.90 -9.756 -130.88 3500 -9.805 -167.89 19.346 73.06 -28.948 77.73 -8.579 -170.03 4000 -11.035 -160.29 18.256 63.61 -24.947 32.85 -14.089 -165.34 * note : s-parameter includes 1 mil thick and 16-mil long au wire
berex b c g13d http: //www.berex.com die outline notes: 1) die thickness 100um 2) bondpad metal thickness 2.8um 3) backside metal au, 5um 4) device is grounded through via holes esd rating esd rating: value: test: standard: class 1c passes <2000v human body model (hbm) jedec standard jesd22-a114b nato cage code: notice berex corporation reserves the right to make changes of product specification or to discontinue product at any time without notice. 2 n 9 6 f
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